manufacturer category series package voltage class rev . date EB52E9 series ? rohs compliant (pb-free) ? temperature compensated crystal oscillator (tcxo) ? stratum 3 ? h cmos output ? 3.3v supply voltage ? ceramic 10-pad smd package ? external voltage control option available ecliptek corp. oscillator EB52E9 ceramic 3.3v os5q 07/07 oscillator EB52E9 electrical specifications 800-ecliptek www.ecliptek.com for latest revision specifications subject to change without notice. h 2.0 l 7.0 w 5.0 0.28ppm maximum 0.37ppm maximum 4.6ppm maximum see part numbering guide 3.3v dc 5% 10ma maximum 90% of v dd minimum 10% of v dd maximum 5nsec maximum 50 5(%) maximum 15pf hcmos load 5ppm minimum 0.0v dc to v dd 5% maximum 100kohms minimum -80dbc/hz -115dbc/hz -135dbc/hz -145dbc/hz enables output enables output disables output: high impedance 1psec maximum 5msec maximum -40c to 125c vs. operating temperature range (v dd = 3.3v dc , v c = 1.65v dc ) inclusive of frequency stability and 24 hours aging inclusive of frequency tolerance, frequency stability, v dd (1%), load (5%), solder reflow, and 20 years aging i oh = -4ma i ol = +4ma measured at 20% to 80% of waveform measured at 50% of waveform 1.65v dc 1.65v dc ; positive transfer characteristic at offset of 10hz at offset of 100hz at offset of 1khz at offset of >10khz no connect +0.9v dd minimum +0.1v dd maximum f j = 12khz to 20mhz nominal frequency (mhz) frequency stability total holdover stability total frequency tolerance operating temperature range supply voltage (v dd ) input current output voltage logic high (v oh ) output voltage logic low (v ol ) rise/fall time duty cycle load drive capability external trim (control voltage option) control voltage range linearity input impedance typical phase noise (at 12.800mhz) tri-state input voltage (v ih and v il ) rms phase jitter start up time storage temperature range 6.400, 6.500, 9.720, 10.000, 12.800, 13.000
manufacturer category series package voltage class rev . date ecliptek corp. oscillator EB52E9 ceramic 3.3v os5q 07/07 a b c d e f 16.00.2 7.50.1 6.750.1 4.00.1 2.00.1 f g h j k l 8.00.1 b0* 1.5 +0.1- 0.0 a0* 0.32 0.05 k0* tape m n o p q 1.5 min 50 min 20.2 min 13.00.2 40 min r s t u v qty/reel 2.5 min 10 min 22.4 max 360 max 16.4+2-0 1,000 reel *compliant to eia 481a mechanical dimensions all dimensions in millimeters marking specifications environmental/mechanical specifications suggested solder pad layout all dimensions in millimeters tape and reel dimensions all dimensions in millimeters tolerances= + 0.1 characteristic specification fine leak test mil-std-883, method 1014, condition a gross leak test mil-std-883, method 1014, condition c mechanical shock mil-std-202, method 213, condition c vibration mil-std-883, method 2007, condition a solderability mil-std-883, method 2003 temperature cycling mil-std-883, method 1010 resistance to soldering heat mil-std-202, method 210 resistance to solvents mil-std-202, method 215 line 1: e xx.xxx frequency in mhz (5 digits maximum + decimal) line 2: xx y zz week of year last digit of year ecliptek manufacturing identifier 800-ecliptek www.ecliptek.com for latest revision specifications subject to change without notice. part numbering guide EB52E9 c 1 v - 13.000m tr operating temperature range b=-10c to 60c c=-20c to 70c frequency stability 1 = 0.28ppm maximum packaging options blank=bulk tr=tape and reel frequency external trim n=none (no connection on pad 10) v=voltage control pin 1-3: do not connect pin 4: ground pin 5: output pin 6-7: do not connect pin 8: tri-state pin 9: supply voltage pin 10: no connect or voltage control 7.00 0.10 5.00 0.10 marking orientation 2.00 max 0.40 0.10 0.80 0.10 1.27 0.10 (x4) 2.54 0.10 ( x2 ) 1.00 0.10 (x5) 0.80 0.10 (x4) 1.00 0.10 (x4) 0.60 0.10 (x6) 10 9 1 2 3 4 5 6 7 8 solder land (x5) 6.0 2.54 1.4 (x4) 1.2 (x4) 1.4 1.0 1.8 1.3 marking orientation
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